A Few Things on Designing 2.5D/3D Wafer Handling and Inspection Systems with Robot Arms and Industrial Cameras
Factory Automation (FA) is everywhere in today’s industry 4.0 world, and semiconductor field is no exception. With the new trend of 2.5D/3D IC packaging and wafer testing while stacked, the technologies and requirements have been pushed to a new extreme. It’s not the traditional methods and equipment wouldn’t cut it. But they require too much […]
