With VICO Imaging® 2.5D IC packaging inspection solution, you can confidently inspect 3cm CoWoS (Chip-on-Wafer-on-Substrate) assemblies, containing multiple critical components like a CPU, several GPUs, and a High Bandwidth Memory (HBM). It ensures accurate placement and detects any damage or misalignment during the assembly process, making them ideal for intricate semiconductor inspections.

For higher CoWoS packaging yield and better inspection performance, please contact us to arrange sample testing for further evaluation.